The University of Alabama/Scholarship

Daisy Bond - Alabama Chapter ASID Endowed Scholarship

Amount variesNot guaranteed

Established by the Alabama Chapter of the American Society of Interior Designers to honor Daisy Bond and to promote the education of interior design students at The University of Alabama. Priority of consideration is given to deserving students who are in their junior year and are enrolled in the interior design program in the College of Human Environmental Sciences at The University of Alabama, maintain a 3.0 grade...

Award To Be Determined

Deadline 31 May 2027

Who it is for, in the provider's words

  • Which collegeDaisy Bond - Alabama Chapter ASID Endowed Scholarship - The University of Alabama | Alabama Scholarship Award Manager
  • Who can applyEstablished by the Alabama Chapter of the American Society of Interior Designers to honor Daisy Bond and to promote the education of interior design students at The University of Alabama. Priority of consideration is given to deserving students who are in their junior year and are enrolled in the interior design program in the College of Human Environmental Sciences at The University of Alabama, maintain a 3.0 grade point average, and are student members of the American Society of Interior Designers.

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What you need

The official page does not list required documents. Check the official page before you apply, since a provider can ask for paperwork it does not publish.

How to apply

  1. 1Apply on the official siteApplications are made directly with The University of Alabama. SCRN does not submit anything for you.

Where this comes from

Last checked by SCRN
2026-10-11Verified null days ago
How it was verified
Read from the official page by SCRN's automated checks. Every detail shown is quoted from that page
Source level
Institution listedListed by the institution that administers it. The outside funder's own page has not been read.
Deadline
31 May 2027
How often
one time
In the provider's words: where each detail comes from
Name
Daisy Bond - Alabama Chapter ASID Endowed ScholarshipRead on 2026-10-11 from https://ua.academicworks.com/opportunities/27565
Provider
The University of Alabama | Alabama Scholarship Award ManagerRead on 2026-10-11 from https://ua.academicworks.com/opportunities/27565
What it provides
Established by the Alabama Chapter of the American Society of Interior Designers to honor Daisy Bond and to promote the education of interior design students at The University of Alabama. Priority of consideration is given to deserving students who are in their junior year and are enrolled in the interior design program in the College of Human Environmental Sciences at The University of Alabama, maintain a 3.0 grade point average, and are student members of the American Society of Interior Designers.Read on 2026-10-11 from https://ua.academicworks.com/opportunities/27565
Amount
Award To Be DeterminedRead on 2026-10-11 from https://ua.academicworks.com/opportunities/27565
Deadline
Deadline 05/31/2027Read on 2026-10-11 from https://ua.academicworks.com/opportunities/27565
How to apply
You will be automatically considered based on your completed General Application. To complete the General Application, please sign in .Read on 2026-10-11 from https://ua.academicworks.com/opportunities/27565
Which college
Daisy Bond - Alabama Chapter ASID Endowed Scholarship - The University of Alabama | Alabama Scholarship Award ManagerRead on 2026-10-11 from https://ua.academicworks.com/opportunities/27565
Who can apply
Established by the Alabama Chapter of the American Society of Interior Designers to honor Daisy Bond and to promote the education of interior design students at The University of Alabama. Priority of consideration is given to deserving students who are in their junior year and are enrolled in the interior design program in the College of Human Environmental Sciences at The University of Alabama, maintain a 3.0 grade point average, and are student members of the American Society of Interior Designers.Read on 2026-10-11 from https://ua.academicworks.com/opportunities/27565
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